The company was listed on the Shanghai Stock Exchange Science and Technology Innovation Board in November 2022. The company was founded in November 2017. The company mainly focuses on high-end packaging and advanced packaging technology and products. The factory has perfect IT systems and production automation capabilities, the company has an excellent product structure, and has successfully entered the supply chain of well-known design companies in the domestic and foreign industry. The company is mainly engaged in integrated circuit packaging and testing business, provides integrated circuit packaging and testing solutions for integrated circuit design companies, and charges processing fees for packaging and testing services. The company's products mainly include five categories of “high-density fine-pitch convex inverted products (FC products), system-level packaging products (SiP), wafer-level packaging products (Bumping and WLP), flat pinless packaging products (QFN/DFN), and microelectromechanical system sensors (MEMS)”. Corporate honors: National High-tech Enterprise, selected in the fourth batch of “Major Integrated Circuit Project Enterprises List” in 2020, and has been awarded “Zhejiang Province's Top 100 Electronic Information Enterprises with Growth Characteristics”, “Zhejiang Top 100 Creative Enterprises”, “Zhejiang Shangyun Benchmark Enterprise”, “Ningbo's Top Ten Digital Economy Enterprises”, “Yuyao Municipal People's Government Quality Award” “2022 Ningbo Top 100 Enterprises with Management Innovation and Enhancement”, “Zhejiang High-tech Enterprise” The “Research and Development Center” and the “2.5 billion block high density integrated circuit and module packaging project for communication” were rated as major projects in Zhejiang Province and won many honors such as a national green factory and advanced packaging testing enterprise.